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MagnaChip Introduces a Step-Down DC/DC Converter for Smartphone Power Amplifier Applications
Date : 2013/03/12

MagnaChip Introduces a Step-Down DC/DC Converter for Smartphone Power Amplifier Applications
 

SEOUL, South Korea and Cupertino, Calif., March 11, 2013 -- MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it has introduced a step-down DC/DC converter (model: MAP7153) designed to improve smartphone power amplifier performance and efficiency.

The MAP7153 optimizes power efficiency and extends smartphone battery life by converting output voltage into bypass or high voltage while operating in high power mode, or into low voltage while in low power mode.

The MAP7153 features fast transition time, excellent line and load regulation, and minimum footprint as a result of its reduced die size and small 1.32mm x 1.27mm WLCSP package. Two switching frequencies are also selectable in the MAP7153. A 3MHz option provides improved efficiency while a 6 MHz option saves printed circuit board space by utilizing smaller inductors.

“Customers are demanding increased performance and power efficiency from their smartphones,” said H.K. Kim, EVP and General Manager of MagnaChip’s Display and Power Solutions Divisions. “By incorporating our MAP7153 into their designs, smartphone manufacturers can continue to provide new and improved products that significantly enhance energy efficiency and battery capacity in the fast growing smartphone market.”

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.


CONTACTS

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:

Chankeun Park
Senior Manager, Public Relations
Tel. +82-3-6903-3195
chankeun.park@magnachip.com
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