Events Archives - Page 4 of 10 - Magnachip Semiconductor

SEOUL, South Korea and SAN JOSE, Calif., Jan. 6, 2017 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced it was given the prestigious “2016 Best Supplier Award” by LG Display.

The “Best Supplier Award” is the highest possible level of recognition presented to a supplier by LG Display for delivering outstanding product quality. MagnaChip’s achievement is notable because approximately 180 suppliers competed for the award. This is the second consecutive year in which MagnaChip received a supplier award from LG Display. Last year, MagnaChip was honored with LG Display’s “2015 Excellence Supplier Award”.

Korea-based LG Display each year honors key component suppliers that have demonstrated competence for both “zero-defective” products and “zero-accident” performance. Of LG Display’s myriad suppliers, 15 are selected to receive the “Excellence Supplier Award” and the top five suppliers of the year are presented with the “Best Supplier Award”. The “2016 Best Supplier Award” is presented at LG Display’s Annual Quality Festival, where LG Display employees and suppliers are recognized for quality-related achievements.

MagnaChip was selected to receive LG Display’s “2016 Best Supplier Award” in recognition of its achievement of delivering “zero-defective” products and “zero-accident” performance, in particular due to its cooperation with and significant contribution to LG Display’s ongoing efforts to improve manufacturing process stabilization and product competitiveness by building a high-level system of quality assurance.

“MagnaChip has been one of LG Display’s strongest and best partners, doing its best to control quality and maintain partnership this year,” said Mr. Deuk Jung Lee, Senior Vice President and Head of the Quality Assurance Center at LG Display. “We deeply appreciate MagnaChip for its concerted and cooperative efforts to improve LG Display’s manufacturing process stabilization and product competitiveness.”

“I am very pleased and excited that we were able to follow up our selection as the 2015 winner of LG Display’s ‘Excellence Supplier Award’ with the ‘Best Supplier Award’ in 2016, which is highest award given by LG Display to its suppliers,” said YJ Kim, CEO of MagnaChip Semiconductor. Mr. Kim added, “Winning these awards from LG Display clearly shows our ongoing commitment to high quality standards and high levels of customer service, and also demonstrates the value of our technology leadership. We will continue to strive to deliver the highest quality components to LG Display and to the consumers who use LG Display products.”

About MagnaChip Semiconductor
MagnaChip is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high-volume consumer, communication, industrial and computing applications. The Company’s Display Solutions, Power Solutions, and Foundry Services Groups provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip owns a portfolio of more than 3,500 registered and pending patents, and has extensive engineering, design and manufacturing process expertise resulting from its 30-year operating history. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., Nov. 14, 2016 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers 0.13 micron EEPROM- based RF-CMOS technology. This RF-CMOS process was developed using a P-type substrate, which is tailored specifically for wireless applications.

The primary purpose for developing the 0.13 micron EEPROM based RF-CMOS technology is to support Smart Wireless MCU products, which frequently use BLE (Bluetooth Low Energy) as the main wireless communications technology. BLE, also called Bluetooth Smart, is a Bluetooth technology that transmits and receives low-power and low-capacity data, reaching a radius of 10 meters using the 2.4GHz frequency range. To satisfy this market need, MagnaChip has developed a process applicable for Smart Wireless MCU products with embedded RF devices in the 0.13 micron EEPROM process. MagnaChip’s technology, which consumes less power, makes it suitable for various applications that utilize Smart Wireless MCUs, such as smartwatches, smart remote controllers, toys, beacons, wearables, 3D glasses and sensor hub wireless chargers.

Furthermore, MagnaChip’s RF-CMOS technology includes the necessary components such as RF-CMOS devices and passive devices including EEPROM IP. The EEPROM IP is also usable up to 64K bytes of high density. Also, RF modeling for CMOS, HR resistor, MIM capacitor, MOM capacitor, varactor diodes and inductor components was completed for the RF design, and the 4-micron-thick metal process was developed for the RF design. In particular, low Vt N/PMOS was developed to improve the transistor’s RF performance.

To capitalize on the many beneficial features, such as efficient power consumption and wide usability, MagnaChip has been developing various RF-CMOS technologies and will begin full-scale mass production in 2017. MagnaChip is offering RF-SOI and also RF-CMOS processes, which demonstrates that the company has made significant progress in becoming an RF process specialty foundry. Due to increased usage of Smart Wireless MCU products in smart homes, the MCU market is expected to show significant growth in the near future, according to industry observers.

YJ Kim, MagnaChip’s Chief Executive Officer, commented, “We are pleased to offer our 0.13 micron EEPROM based RF-CMOS technology for applications in the Smart Wireless MCU market. Our goal is to continue to develop competitive processes and IPs to serve growing markets and to diversify our technology portfolio to meet the many application-specific needs of our foundry customers.”

For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., Oct. 3, 2016 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today the availability of a new 0.13 micron Slim Flash process technology, based on 0.13 micron EEPROM. While maintaining the same performance characteristics of the existing EEPROM process, Slim Flash process technology is highly cost competitive because it reduces the number of layers to be embedded by 20 percent and cuts the manufacturing turnaround time by 15 percent.

The embedded NVM (Non-Volatile Memory) EEPROM process, integrates logic, analog, and memory into one chip, and has been adopted in a wide range of applications such as automotive, MCU, touch IC and Auto Focus IC.

Qualification test for 0.13 micron Slim Flash process technology was completed in both device performance and yield categories. All devices passed the WLR (Wafer Level Reliability) test, SRAM, and reliability test of standard cell library. In particular, high density EEPROM IP satisfied all categories related to endurance and data retention test.

In addition to the existing 0.13 micron EEPROM, MagnaChip plans to build a Slim Flash portfolio by merging Slim Flash into various technologies, including BCD and High Voltage. MagnaChip is currently engaging with customers using the new technology, with several products currently in development. Volume production of the Slim Flash process technology is expected to begin as early as the fourth quarter of 2016.

“With the introduction of our 0.13 micron Slim Flash process technology, customers now have access to a cost-saving and time-saving manufacturing process that will improve their overall time to market,” said YJ Kim, Chief Executive Officer of MagnaChip.

About MagnaChip Semiconductor Corporation

MagnaChip is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high-volume consumer, communication, industrial and computing applications. The Company’s Display Solutions, Power Solutions, and Foundry Services Groups provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip owns a portfolio of more than 3,500 registered and pending patents, and has extensive engineering, design and manufacturing process expertise resulting from its 30-year operating history.

For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., July 18, 2016 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today it will host its annual Foundry Technology Symposium at Sheraton Hsinchu Hotel, Taiwan, on September 27th, 2016.

The Foundry Technology Symposium will showcase MagnaChip’s latest technology offerings and provide a wide-ranging overview of MagnaChip’s manufacturing capabilities, specialty technologies, target applications and end-markets. In addition, MagnaChip plans to discuss current and future semiconductor foundry business trends, and provide insights into key end markets.

At the Symposium, MagnaChip will showcase its proprietary foundry technology used by customers to help enable the design and production of:
Mixed-Signal for Fingerprint Sensor ICs and IoT (Internet of Things) applications,
BCD (Bipolar-CMOS-DMOS) for high-performance analog and power management applications, and
NVM (Non-Volatile Memory) and UHV (Ultra High Voltage) for touch IC and LED lighting applications.

In addition, MagnaChip will provide a comprehensive overview of technologies used in various products and end markets including smartphones, tablet PCs, automotive, industrial and wearables. Technical experts and customer-facing representatives from MagnaChip will highlight the Company’s customer-friendly design environment and proprietary on-line customer service tool, “iFoundry”.

“We are pleased to host our 2016 Foundry Technology Symposium in Taiwan,” said YJ Kim, Chief Executive Officer of MagnaChip. “We will offer attendees an opportunity to better understand how our foundry offerings and specialty technologies may be used to develop leading-edge products targeted to high-growth markets.”

More than 100 fabless companies, IDMs (Integrated Device Manufacturers) and other semiconductor companies are expected to attend the symposium. To register for MagnaChip’s 2016 Foundry Technology Symposium in Hsinchu, and for further details regarding the event, please visit www.magnachip.com or ifoundry.magnachip.com.

The Foundry Technology Symposium in Taiwan will be the second such event held in Asia in 2016; two U.S. Foundry Technology Symposiums were held in May, 2016, in Santa Clara, CA, and Austin, TX.

About MagnaChip Semiconductor
MagnaChip is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high-volume consumer, communication, industrial and computing applications. The Company’s Display Solutions, Power Solutions, and Foundry Services Groups provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip owns a portfolio of more than 3,500 registered and pending patents, and has extensive engineering, design and manufacturing process expertise resulting from its 30-year operating history.
For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., May 9, 2016 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it has expanded its line of cost effective 0.18 micron multiple-time programmable intellectual property (MTP-IP) devices. Jointly developed with Yield Microelectronics Corporation (YMC) of Taiwan to address the increasing MTP-IP demand for microcontroller (MCU) and touch IC applications, it also enables cost-effective IC designs and high performance non-volatile memory solutions.

The new MTP-IP was developed by using MagnaChip’s 0.18 micron mixed signal 5V processes, which significantly reduce the number of mask layers and manufacturing process steps, making it possible to provide cost-competitive MTP solutions. This was accomplished through the use of smaller MTP cells offering diverse memory sizes ranging from low density to high density options. The new MTP-IP is operable at a wider range of voltages from 1.8V~5.5V, making the solution suitable for (MCU) applications.

This newly developed MTP-IP solution also provides high performance and reliability for more stringent customer applications and covers the wide-range of multiple-time programmable memory densities needed in the consumer electronics market. MagnaChip is enhancing its MTP-IP portfolio for customers by adding MTP-IP for 0.18 micron, mixed-signal 5V only processes as well as 0.35 micron BCD processes and 0.18 micron BCD and mixed-signal processes. Beyond current MCU and touch control panel applications, these new MTP-IP solutions are targeting the mid-to-low-tier consumer appliance markets, particularly in China. The jointly developed range of MTP-IP solutions simplifies the engineering process, reduces manufacturing processing time and enhances cost competitiveness.

“The continued collaboration between MagnaChip and YMC has produced greater innovation and variety in the types of MTP solutions being offered to customers,” said Daniel Huang, YMC’s President. “YMC sees its continued strategic partnership with MagnaChip as a long-term benefit to YMC and MagnaChip customers.”

“We are very pleased with our on-going collaboration with YMC, a leading IP solutions provider in Taiwan,” said YJ Kim, MagnaChip’s Chief Executive Officer. “Our continued partnership allows us to offer cost-effective, high-performance non-volatile memory solutions to meet the increasing application-specific needs of our global foundry customers.”

About Yield Microelectronics Corporation
Yield Microelectronics Corporation (YMC), located in Taiwan’s Chu-Pei city, is a specialized embedded logic multiple-time non-volatile memory (NVM) IP provider. YMC’s innovative NVM MTP-IP products are licensed to design houses and semiconductor foundries, allowing them to integrate crucial non-volatile memory with analog and digital functionality on a single chip. YMC’s NVM IP is characterized by its competitive cell and macro size, adopts logic-based architecture and features the scalability and ease of porting for different technologies and processes such as logic, high-voltage, mixed-mode, bipolar-CMOS-DMOS and many others. For more information, please visit www.ymc.com.tw.

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest ranges of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., April 25, 2016 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it is now shipping its e-Compass sensor (MXG2320) in China to a major smartphone manufacturer that is targeting mobile markets in China and India.

MagnaChip’s MXG2320 e-Compass product is a Hall effect magnetic direction sensor. The MXG2320 supports high resolution (0.6uT/bit) at low voltage (1.8V/3.3V) and is well-suited for mobile applications because of its small die size (1.2mmX1.2mm). The e-Compass design win in China is recognition of MagnaChip’s mixed-signal design and manufacturing expertise and reflects the potential for future design-win opportunities for its entire line of sensor products.

In addition to the MXG2320, MagnaChip is in the final development stages of a buffer-embedded, e-Compass sensor with the smallest footprint (1.2mmX0.8mm) currently available in the market. This product is now undergoing beta testing and is being evaluated for use by a major smartphone manufacturer.

The e-Compass has become an essential part of mobile device applications and has now found its way into new applications such as virtual reality, indoor navigation and drone control. An e-Compass sensor interprets compass direction through the detection of the earth’s magnetic polar fields.

“MagnaChip has been developing e-Compass and other sensor products for mobile applications as part of its strategy to target emerging growth markets,” said YJ Kim, CEO of MagnaChip Semiconductor. “I am very pleased to say that this e-Compass design win is very significant because it marks the beginning of our expansion into the China mobile market with our line of sensor products.”

About MagnaChip Semiconductor Corporation
Headquartered in South Korea, MagnaChip is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high-volume consumer applications. MagnaChip believes it has one of the broadest and deepest ranges of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-3-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., April 6, 2016 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it will host its Annual U.S. Foundry Technology Symposium at Levi’s Stadium in Santa Clara, CA on May 10th and at the Driskill Hotel in Austin, TX on May 12th, 2016.

The primary purpose of the Foundry Technology Symposium is to showcase MagnaChip’s most up-to-date technology offerings and to provide an in-depth understanding of MagnaChip’s manufacturing capabilities, its specialty technology processes, target applications and end-markets. Furthermore, during the symposium, MagnaChip plans to discuss current and future semiconductor foundry business trends, and also cover presentations in key markets through guest speeches.

While providing an in-depth overview of its specialty process technologies, MagnaChip will also highlight its technology portfolio and its future roadmap, including technologies such as mixed-signal, which supports technologies in the Fingerprint Sensor IC and the Internet of Things (IoT) sector, Bipolar-CMOS-DMOS (BCD) for high-performance analog and power management applications, Ultra-High Voltage (UHV) and Non-Volatile Memory (NVM). In addition, MagnaChip will present its technologies used in applications including smartphones, tablet PCs, automotive, industrial, LED lighting and the wearables segments. MagnaChip will also review its customer-friendly design environment and an on-line customer service tool known as “iFoundry”.

“We are very pleased to host MagnaChip’s Annual Foundry Technology Symposium in the US again this year,” said YJ Kim, Chief Executive Officer of MagnaChip. “We plan to offer participants an opportunity to better understand the foundry and the application market dynamics, and to provide insights into MagnaChip’s specialty process technologies.”

More than one hundred fabless companies, IDMs (Integrated Device Manufacturers) and other semiconductor companies are expected to attend the two events. To sign up for MagnaChip’s Annual Foundry Technology Symposium in Santa Clara and Austin, and for more details regarding the symposium, please visit www.magnachip.com or ifoundry.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., April 4, 2016 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that MagnaChip was selected for “The Best Cooperative Partner Award” by Sitronix Technology, a leading fabless IC company based in Taiwan.

The business relationship with Sitronix has a long history with MagnaChip having been chosen as their foundry to provide wafer manufacturing services for eBook MCUs and display driver ICs applications. More recently, the product mix has expanded to include small TFT panel driver ICs for feature phones and large TFT panel driver ICs. The total cumulative volume of wafers shipped to Sitronix has surpassed the 1 million mark, a significant milestone indicating the strategic importance of the on-going business relationship for both companies.

“We strongly believe that the continued support from MagnaChip has helped us grow our business to where we are today,” said Vincent Mao, Chairman and Chief Executive Officer of Sitronix. “We look forward to continuing our business relationship while continuously finding areas to collaborate in the future.”

“I am very pleased that MagnaChip was honored with the Best Cooperative Partner Award from our important business partner, Sitronix Technology,” said YJ Kim, Chief Executive Officer of MagnaChip. “We are committed to Sitronix and all our business partners to find areas where we can participate in technological development and product growth to provide leading-edge customer solutions.”

About Sitronix
Sitronix Technology Corporation (TWSE: 8016) is a Taiwan-based fabless semiconductor company that primarily focuses on display driver ICs (DDIs) for entry-level mobile phones, industrial displays, and automotive systems. Sitronix is the feature phone DDI market leader with a global footprint spanning Latin America, Southeast Asia, Africa and other regions. In recent years, the company has also seen tremendous growths in its smartphone and sensor businesses.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and BEIJING, Feb. 1, 2016 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it will be hosting its first Foundry Technology Symposium of 2016 at the Hilton Beijing Wangfujing Hotel in Beijing on March 15, 2016. After two successful symposiums in Shanghai and Shenzhen China in September and November of 2015, this upcoming technology symposium in Beijing, China, is a continuation of MagnaChip’s global foundry strategy to enhance MagnaChip’s brand awareness in the China market.

Major topics to be discussed are MagnaChip’s current and future semiconductor foundry business roadmap, specialty technologies, target applications and end-markets. This symposium is a direct response to the increased interest and demand coming from our Chinese fabless customers for advanced analog and mixed-signal specialized foundry technologies.

MagnaChip, which is the largest Korea-based analog and mixed-signal foundry service provider, will highlight in Beijing its technology portfolio with discussions focused on mixed-signal, low power technologies in the Internet of Things (IoT) sector, Bipolar-CMOS-DMOS (BCD) for high-performance analog and power management applications, Ultra-High Voltage (UHV) for LED lighting applications and Non-Volatile Memory (NVM) for touch and MCU applications. In addition, MagnaChip will present technologies used in applications including smartphones, tablet PCs, automotive, LED lighting, consumer wearables and IoT. MagnaChip will also showcase its customer-friendly design environment and an on-line customer service tool known as “iFoundry”.

“We see this Foundry Technology Symposium in Beijing as an opportunity to better understand our customer’s requirements and their technology roadmap,” said YJ Kim, Chief Executive Officer of MagnaChip. “Through this event, we strongly believe that we will be able to better serve our China partners and our global foundry customers with our long history of providing successful foundry services based on our deep technological expertise.”

Many fabless, IDMs (Integrated Device Manufacturers) and other semiconductor companies are expected to attend MagnaChip’s Beijing technology symposium.

To sign up for the event, and to receive more detailed information regarding the symposium, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., Jan. 4, 2016 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers a high performance and cost competitive 0.13 micron 1.5/2.5V RF Silicon on Insulator (SOI) process. MagnaChip’s 0.13 micron RF SOI process is a dual-gate process that simultaneously supports 1.5V and 2.5V and uses a Thin-Film SOI wafer, which has far better RF performance than other industry standard wafers.

Switches, Tuners and Low Noise Amplifiers (LNA) are key components of Front-End Modules (FEM) and MagnaChip’s 0.13 micron RF SOI process is optimized for the design of antenna switches, tuners and supports efficient LNA design. In addition, MagnaChip’s 0.13 micron RF SOI process features low cost and competitive performance, and is particularly suited for Cellular and Wi-Fi applications.

The 2.5V switch device process provides a competitive Ron*Coff, a level of performance equal to or better than our competitors. Furthermore, the process also supports 1.5V CMOS including noise figure modeling which helps to enable competitive logic design. Our CMOS process also supports Body-Contacted and Floating-Body, enabling flexible product design. Additionally, the process supports a MiM Capacitor, NMOS Varactor, High-R Poly Resistor and Poly/Diffusion Resistor including three types of inductors. For customers who prefer to use only 2.5V CMOS alone, our 2.5V single-gate process is offered. For customers who require higher-voltage device capabilities, 5V and 20V device support is under development.

“We are very pleased to offer our 0.13 micron 1.5/2.5V RF SOI process solution that combines both high-performance and cost efficiency,” said Dr. TJ Lee, Executive Vice President of MagnaChip’s Foundry Services Group. “We will continue to expand our RF SOI process offerings to meet the growing needs of our global customer-base.”

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest ranges of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

Category: Events

Magnachip Selected as “2016 Best Supplier” by LG Display

Magnachip to Offer 0.13 micron EEPROM based RF-CMOS Technology for Wireless Applications

Magnachip Announces Cost Competitive 0.13 micron Slim Flash Process Technology

Magnachip to Host Annual Foundry Technology Symposium in Hsinchu, Taiwan in September 2016

Magnachip and YMC Expand Cost-Effective 0.18um Multiple-Time Programmable (MTP) Manufacturing Processes

Magnachip Begins Delivery of e-Compass Sensors in China

Magnachip to Host Its Annual Foundry Technology Symposium in Santa Clara (California) and Austin (Texas)

Sitronix Selects Magnachip for their Best Cooperative Partner Award

Magnachip to Host 2016 Foundry Technology Symposium in Beijing, China

Magnachip to Offer High Performance and Cost Competitive 0.13 micron 1.5/2.5V RF SOI Process