12月 2011 - Magnachip Semiconductor

SEOUL, South Korea and CUPERTINO, Calif., Dec. 19, 2011 – MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), an Asia-based foundry, designer and manufacturer of analog and mixed-signal semiconductor products, announced that it will begin supplying display driver ICs to be used in the AMOLED display panels for multiple Microsoft Windows-based smartphones.

MagnaChip’s display driver ICs will be used in AMOLED panels that support WVGA (480X800) level resolution and 16M (24bit) colors. The product features MIPI DSI (Mobile Industry Processor Interface Display Serial Interface) high-speed serial interface technology designed specifically for smartphone applications. The display driver ICs will also include ACL (Automatic Current Limit) which significantly improves performance and power consumption efficiency.

T.Y. Hwang, President and General Manager of MagnaChip’s Display Solutions Division, commented, “Display driver ICs have grown as a percent of our total design-win portfolio from one percent in 2010 to ten percent in 2011. Supplying AMOLED display driver ICs allows us to strengthen and expand our strategic partnerships with top tier global smartphone manufacturers, as we continue our focused research and development efforts in this area.”

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and CUPERTINO, Calif., Dec. 12, 2011 – MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that it now offers a redistribution layer (RDL) metal process for wafer bumping and an IO structure and process that is fully compatible with copper wire bonding. This process is designed to reduce semiconductor packaging costs while meeting the specialized application needs of foundry customers.

The redistribution layer metal process converts wire bond pads at the perimeter of the die to an array of bump pads that are relocated to the center area of the die. The relocation of pads allows for a larger pad pitch for wafer bumping making it possible to use low cost solder bumps instead of plated bumps. The redistributed bond pad process has recently found its way into other advanced packaging methodologies such as wafer-level chip-scale packaging, system-in-package, and 3-D packaging. This process requires one additional aluminum layer and is fully compatible with MagnaChip’s standard CMOS process.

Related to packaging trends, copper versus gold wire bonding has become one of the preferred methods for semiconductor interconnection because of its cost and performance features. Copper is a lower cost alternative to gold for packaging applications and has higher electrical and thermal conductivity making copper wire an excellent bonding material. In addition, copper bonds have greater reliability at elevated temperatures than gold bonds because of its lower tendency to form intermetallic compounds. One of the major challenges of copper wire bonding had been the significant mechanical stress imposed on bonding pads. This stress often resulted in dielectric cracks beneath the pads. MagnaChip resolved this issue in cooperation with the major packaging companies, including Amkor.

T.J. Lee, Senior Vice President and General Manager of MagnaChip’s Corporate Engineering stated, “We are very pleased to announce the offering of cost competitive backend processes such as the redistribution layer metal process and copper wire bonding. Our goal is to continue to develop highly differentiated and cost-effective technology solutions to meet the increasing application specific needs of our foundry customers.”

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and CUPERTINO, Calif., Dec. 5, 2011 – MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that it now offers module based process design kits (PDK) designed specifically to support power and large display driver IC design applications.

MagnaChip’s PDK supports a diverse set of design requirements used for product development based on the company’s advanced process technologies. The process design kits incorporate design rule documentation, spice model for circuit design, schematic symbol typology, PCell (parameterized cell), DRC for layout design, LVS, LPE, and other technical files.

MagnaChip began development of the Modular PDK set methodology at the beginning of 2010. Currently, standardization of design rule documents, standard test patterns and modular DRC/LVS are now being applied to power and large display driver IC applications.

The advantage of a modular PDK approach is the fast provisioning of quality process design kits through the use of verified standardized modules for each technology. Another advantage of MagnaChip’s PDK is that it features user-friendly functions such as one click downloads and installs which enhance the customer’s experience. In addition, development time when using MagnaChip’s newly launched PDK sets can be reduced by more than 50% as a result of the modular and pre-standardization approach to design.

T.J. Lee, Senior Vice President and General Manager of MagnaChip’s Corporate Engineering commented, “We are very pleased to announce the offering of our module based process design kits for power and large display driver IC applications. By using a modular PDK approach, MagnaChip can dramatically reduce the cycle time for PDK development and verification. As a result, we provide enhanced cost competitiveness and design flexibility while continuing to provide user-friendly and cost-effective PDKs for our foundry customers.”

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

月度归档： 2011年12月

Magnachip to Supply AMOLED Display Driver ICs for Microsoft Windows-Based Smartphones

Magnachip to Offer Cost Competitive Redistribution Layer Metal Process and Copper Wire Bonding

Magnachip Launches Module Based Process Design Kits for Power and Display Driver Applications