月度归档： 2018年11月

投资者

Nader Tavakoli Appointed as Chairman of the Board of Magnachip Semiconductor

SEOUL, South Korea and SAN JOSE, Calif., Nov. 29, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip” or “Company”) (NYSE: MX) today announced the appointment of Nader Tavakoli as its new non-executive Chairman of the Board of Directors, effective November 26, 2018. Mr. Tavakoli replaces Gary Tanner as the Company’s Chairman. Mr. Tanner will remain a Director on the Board and will continue to serve as a member of the Audit, Compensation and Risk Committees of the Board. Mr. Tanner joined MagnaChip’s Board in August 2015, and has served as its non-executive Chairman since October 2016.

“The Board wishes to thank Gary for his leadership as Chairman of the Board, helping to lead MagnaChip’s growth and the building of a solid foundation for future success,” said Nader Tavakoli. “I am honored to have been appointed as MagnaChip’s Chairman, and I look forward to working with the entire Board of Directors and the management team to improve profitability and build shareholder value.”

Mr. Tavakoli has served on MagnaChip’s Board of Directors since 2009. He has served on, and chaired, various committees of the Board, and is currently a member of the Audit, Compensation and Risk Committees. Mr. Tavakoli is the Chief Executive Officer of Cobalt International Energy and serves as a Plan Administrator of MF Global Inc. Mr. Tavakoli served as the Chairman, CEO and President of Ambac Financial Group and Ambac Assurance Corporation, having led the successful operational and financial restructuring of Ambac from 2012 through 2016. Mr. Tavakoli also has served on a number of Boards in diverse industries, including as Chairman of the Board of the holding company for Aman Resorts Group, an international hospitality and real estate development company, and as a director of NextWave Wireless, Inc., prior to that company’s sale to AT&T Inc.

“I look forward to working with Nader, our new Chairman, to build a stronger and more profitable MagnaChip,” said YJ Kim, MagnaChip’s CEO and Director. “And we are very grateful that MagnaChip will continue to benefit from Gary’s leadership on the Board.”

The following link provides additional information on each of the directors who serve on the Company’s Board of Directors: http://investors.magnachip.com/corporate-governance/board-of-directors.

About MagnaChip Semiconductor Corporation
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of more than 3,000 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:
In the United States:
Bruce Entin
Investor Relations
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director, Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com

电源解决方案

MagnaChip To Commence Volume Production of High-Voltage IGBT Products for Power Module Targeted to Industrial Applications

– IGBT P-series features 1200V, 100A and wide SOA (Safe Operating Area) for industrial applications, including 10kW+ 3-phase motors and photovoltaic inverters –

SEOUL, South Korea and SAN JOSE, Calif., Nov. 26, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced that volume production has commenced for an IGBT product for power module targeted to high-voltage industrial applications. IGBT is one of a MagnaChip family of Power standard products called Insulated Gate Bipolar Transistors.

The new IGBT P-series (“MBW100T120PHF”) has both high current and high voltage capabilities of 1200V and 100A, and has achieved a low saturation voltage Vce(sat) of 1.71V and low switching losses by using Field-Stop Trench technology. MBW100T120PHF allows designers to operate devices at an improved switching frequency, which enables reducing the size and cost of capacitors and inductive devices in circuits. To product designers, this translates into high power density, small size and low material cost of products. MBW100T120PHF is operable up to four times the rated current, and with a wide SOA (Safe Operating Area) well-suited for industrial applications which require high power. In addition, by optimizing the resistance embedded inside the chip, MBW100T120PHF enables a parallel structure design, which allows multiple chips to operate simultaneously.

MBW100T120PHF is expected to improve overall system stability and energy efficiency of applications by reducing the power loss from DC-AC power conversions for high-voltage industrial applications, such as 10kW+ 3-phase motor and photovoltaic inverter systems.

“We are pleased to launch our newest IGBT P-series product for industrial power modules, with high-voltage and high-current capabilities of 1200V and 100A,” said YJ Kim, CEO of MagnaChip. “The introduction of this IGBT P-series product will further expand our IGBT power product portfolio and enhance our reputations as a market leader of high-voltage power standard products.”

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,100 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:
United States (Investor Relations):
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

USA media / industry analysts:
Mike Newsom
LouVan Communications, Inc.
Tel. +1-617-803-5385
mike@louvanpr.com

Korea / Asia media:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com

活动

Magnachip Offers Automotive-Grade 0.18 micron BCD Process Technology with up to 200V Operation Voltage

SEOUL, South Korea and SAN JOSE, Calif., Nov. 12, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers Foundry customers a 0.18 micron BCD (Bipolar-CMOS-DMOS) 200V high-voltage process. This new BCD process uses SOI (Silicon On Insulator) substrates with solid high-voltage isolation and extends MagnaChip’s existing BCD processes from 100V to 200V. Having 200V devices in a BCD process is valuable because it enables a Power IC to be designed for high voltage applications, including automobiles, electrical vehicles, industrial motor drivers, ultrasonic medical imaging systems and solar panels.

Utilizing SOI substrates and MagnaChip’s proprietary deep-trench isolation technology provides advantages over the bulk silicon based BCD that include higher isolation breakdown voltage, smaller isolation size, better substrate noise immunity, latch-up immunity and high-side isolation of power blocks with insulating silicon dioxide layer between active silicon layers and substrates. In this technology, two types of power LDMOS technology (Laterally Diffused Metal Oxide Semiconductor) are supported up to 200V. The first type has low specific on-resistance (Rsp), which increases packing density of power blocks. The second type supports full ranges of SOA (safe operation area) to guarantee long-term reliability with all ranges of VDS (Drain-to-Source voltage) and VGS (Gate-to-Source voltage). Foundry customers can select either type, depending upon their circuit requirements.

Many valuable option devices are also supported in the new 0.18 micron 200V BCD process to enhance design integration and flexibility. The option devices include high performance bipolar transistors, Zener diode, Schottky diode, high resistance poly resistor, metal-insulator-metal capacitor, metal-oxide-metal capacitor, electrical fuse and multi-time programmable memory.

Certain end markets, including automotive, require that power ICs are capable of achieving high-temperature reliability and high operation voltages. This is especially the case for Electric vehicles and hybrid cars as more 48V battery systems are adopted. To meet these increased demands, MagnaChip’s new 200V BCD technology was qualified based on the automotive-grade-qualification specification of AEC-Q100 with Grade0 temperature condition between -40 to 150 °C.

YJ Kim, Chief Executive Officer of MagnaChip, commented, “We are very pleased to offer our 0.18 micron 200V BCD process solution for attractive applications including electric vehicles and solar panels.” Mr. Kim added, “Our goal is to continue to increase our power technology portfolio to meet the demanding requirements of our Foundry customers in various markets.”

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of more than 3,000 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

United States (Investor Relations):
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

USA media / industry analysts:
Mike Newsom
LouVan Communications, Inc.
Tel. +1-617-803-5385
mike@louvanpr.com

Korea / Asia media:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com

投资者

Magnachip Appoints Semiconductor Veteran Jeong Ki Min as Chief of Strategic Planning

— Former Samsung and SK Telecom Executive Brings 33 Years Experience —

SEOUL, South Korea and SAN JOSE, Calif., Nov. 1, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced the appointment of Jeong Ki Min to the newly created position of Chief of Strategic Planning. Mr. Min, a seasoned semiconductor executive with 33 years of global business experience, previously held senior positions at Samsung Semiconductor, Samsung Electronics, Samsung Display, and SK Telecom. He reports directly to YJ Kim, MagnaChip’s Chief Executive Officer.

During his more than three decades in the high-tech industry, Mr. Min has initiated and negotiated high-profile joint venture agreements, strategic alliances and acquisitions. Among his other accomplishments, Mr. Min also has led new business planning teams, managed R&D operations, led Foundry marketing teams, and helped develop semiconductor growth strategies.

Most recently, Mr. Min was Senior Vice President, Office of the Vice Chairman of SK Telecom. Prior to that, Mr. Min held various leadership roles at several divisions of Samsung during a 25-year career.

At MagnaChip, Mr. Min will have a variety of responsibilities, including strategic planning related to semiconductor technologies, products, and markets. He also will play a key role in activities related to potential alliances, joint ventures and other transactions.

“Mr. Min brings to MagnaChip a wealth of semiconductor experience as well as a strong track record of business success,” said YJ Kim, MagnaChip CEO. “Mr. Min will drive the strategic planning process across MagnaChip and help the management team set the future direction of our company.”

Mr. Min said, “Over the past three years, MagnaChip has been transformed into a powerhouse in the Display and Power standard products businesses and become an industry leader in the analog and mixed signal Foundry business. I’m excited to join MagnaChip and look forward to working with the management team on strategic issues to help MagnaChip achieve the next level of success.”

About MagnaChip Semiconductor

MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,100 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

United States (Investor Relations):
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

Korea / Asia media:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com