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SEOUL, South Korea and SAN JOSE, Calif., March 19, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers a 0.18 micron BCD (Bipolar-CMOS-DMOS) 100V high voltage process. The features of this new BCD process compare favorably with previous generations of process technology.

The new BCD process requires three fewer layers of photo steps by process optimization, and has low specific on-resistance (Rsp) of power LDMOS (Laterally Diffused Metal Oxide Semiconductor) up to 100V. Having 100V devices in BCD process is valuable as there are increasing demands to expand operation voltages and protection voltages to 100V in many applications, such as Power over Ethernet (PoE), AC-DC chargers, solar panel power ICs, and automotive battery systems. In addition, the new BCD process offers automotive-grade reliability for DC-DC converters, LED drivers, motor drivers, battery chargers, and PMICs used in automotive electronics.

In power ICs that use BCD technologies, the area of power transistors like LDMOS occupies major chip area. And the specific on-resistance of power transistors — which is defined as the product of total on-resistance and area of the device when a transistor is turned on — is the key factor that determines overall chip area. As a specialty analog foundry, MagnaChip has improved the specific on-resistance over the past 10 years to assist foundry customers achieve smaller chip sizes and reduce costs. Utilizing MagnaChip’s proprietary deep-trench isolation technology and advanced device designs, the low specific on-resistance of 100V operation LDMOS was achieved on conventional silicon substrates without the use of more expensive SOI (Silicon-On-Insulator) substrates. Overall, with these process advantages, this new 0.18 micron BCD 100V high voltage process can enhance cost effectiveness of customers’ products.

To support power ICs for various applications like consumer, industrial, and especially automotive applications, this process technology was qualified based on the automotive-grade-qualification specification of AEC-Q100 with Grade1 temperature condition between -40 to 125 °C.

There are option devices in the new 0.18 micron BCD process to enhance design integration and flexibility. The option devices include a high performance bipolar transistor, high resistance poly resistor, tantalum nitride resistor with low temperature coefficient, metal-insulator-metal capacitor, metal-oxide-metal capacitor, electrical fuse, and multi-time programmable memory.

YJ Kim, Chief Executive Officer of MagnaChip, commented, “We are very pleased to offer our 0.18 micron BCD 100V process solution that combines both the advantages of high-performance as well as high reliability.” Mr. Kim added, “Our goal is to continue to develop technologies with high performance and high reliability to cover a broad range of applications for our foundry customers”.

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,200 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-5223
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., Feb. 12, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, announced today it now offers the 2nd generation of 0.13 micron BCD process technology integrated with high-density embedded Flash memory. This second-generation BCD process offers advanced features compared to previous BCD processes, which are high-density Flash memory up to 64 kilo bytes, low specific Ron of power LDMOS up to 40V, low number of photo steps and automotive grade reliability. These characteristics make the new generation of BCD process technology highly suitable for programmable PMICs, wireless power chargers, USB-C power-delivery IC products and automotive power ICs.

Traditionally, the non-volatile memories in the BCD process are low in density, below 256 bytes, for trimming purposes. However, today’s electronic devices require more complex functions and lower power consumption. As a result, there is a greater market need for high-density embedded non-volatile memory in the BCD process. This memory includes Flash memory used for power ICs, including programmable PMICs, wireless power chargers and USB-C power-delivery ICs. In some applications, high-density Flash memory up to 64 kilo bytes is used to store programming codes as well as trimming data. Until now, the drawback of implementing high-density embedded memory in other BCD processes has been that it increases the overall number of manufacturing steps.

MagnaChip was able to eliminate 8 photo steps in the second-generation BCD process from the 1st generation by process optimization. Aside from embedded non-volatile memory, the 2nd generation also achieved the improvement of power LDMOS specific Ron performance, which is well suited for high-power requirements up to 40V operation. For IoT and automotive applications, this BCD process provides 1.5V and 5V CMOS devices with very low leakage current level that enables low power consumption. Furthermore, this new BCD process has various option devices for Hall sensors, varactors, inductors, and RF CMOS devices that are useful for highly integrated IC solutions, which give smaller system size and less system cost.

YJ Kim, Chief Executive Officer of MagnaChip, commented, “The integration of analog-based BCD and high density non-volatile memory enables highly suitable ICs and system designs for power management solutions, wireless chargers and power ICs used in smartphones, IoT devices and automotive applications.” Mr. Kim added, “Our goal is to continue to develop specialized and innovative process technologies that meet the changing market requirements of our foundry customers.”

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,200 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., Jan. 16, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX) today announced that members of the executive management team will make an investor presentation at the 2018 Annual Needham Growth Conference in New York City on Wednesday, January 17, 2018 at 1:30 p.m. EST. An audio webcast of the presentation can be heard here: http://wsw.com/webcast/needham84/mx/

The webcast link also can be accessed within the “Investors” section of the MagnaChip website, under the heading of “Investor Events.” A replay of the webcast will be available one hour after the conclusion of the presentation and will be accessible on the MagnaChip website for 90 days.

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Groups provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,300 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

In the United States:
Bruce Entin
Investor Relations
Tel. +1.408.625.1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director, Public Relations
Tel. +82.2.6903.5223
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., Jan. 8, 2018 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced it now offers a multi-level thick IMD (Inter-Metal Dielectric) process for a capacitor with ultra-high breakdown voltage. This capacitor is useful for the digital isolation and capacitive coupling in electronic circuits.

Demand for digital isolators is growing for noise-immune electronics products commonly found in electric vehicles and in industrial, communications and healthcare applications as a substitute for conventional optocouplers. Digital isolators demonstrate superior performance and reliability and can achieve higher levels of integration at lower cost, as compared to optocouplers. Industry analyst expects the worldwide digital isolator market will reach approximately $2 billion by 2023 at a CAGR (Compound Annual Growth Rate) of six percent between 2017 and 2023.

MagnaChip’s multi-level thick IMD process consists of back-end-of-line process module including IMD with a thickness from 5um to 6um per metal layer. Depending on the breakdown and capacitance requirements, the thick IMD can be stacked together up to three layers to allow the design of the metal-insulator-metal capacitor with insulator thickness in the range of 5um to 20um. This capacitor will withstand from about 4 kilo-volts to 15 kilo-volts before breakdown, which is suitable for capacitive isolation of a digital signal from ultra-high voltage noise from outside environments.

The multi-level thick IMD process module, which has already passed the reliability requirements for automotive AEC Q-100, is now integrated into MagnaChip’s 0.18um BCD and Mixed Signal process technologies. The Process Design Kit is available to support on-chip integration.

YJ Kim, MagnaChip’s Chief Executive Officer, commented “We are very pleased to provide a special multi-level thick IMD process for ever-growing capacitive isolation applications. This is a significant addition to our many specialty process technologies.” Mr. Kim added, “We will continue to provide innovative and differentiated technologies to meet the fast-changing needs of our foundry customers.”

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,300 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., Nov. 6, 2017 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today it now offers a 0.35 micron 700V Ultra-High Voltage process technology (UHV) that reduces mask counts, manufacturing time and cost for power-related AC-DC products. This UHV process technology offers 700V nLDMOS, 700V JFET, and 5.5V CMOS devices that are suitable for manufacturing AC-DC converter ICs and LED driver ICs.

The demand for AC-powered products in home appliances continues to increase, creating the need for highly efficient and cost-competitive AC-DC converter ICs, AC-DC chargers and LED driver ICs. MagnaChip’s 0.35 micron 700V UHV process technology is a suitable match to manufacture these types of power-related products.

MagnaChip provides various types of UHV technology to meet the diverse demands of the customers. HP35ULB700, the newly developed UHV process, eliminates five photolithography steps through process simplification compared with MagnaChip’s previous generation of UHV technology, making it possible to reduce manufacturing cost and to accelerate the time to market. Among the devices offered in HP35ULB700 are 700V low Ron nLDMOS, 500V nLDMOS, 700V JFET, 5.5V CMOS, BJT, 700V resistor, BP cap, and MIM and fuse. All these devices enable the integrated solution of AC-DC converter ICs and LED driver ICs. The 700V low Ron nLDMOS devices offer improved specific-on-resistance of 150 mohm·cm2. In addition, the devices enable various design schemes, including the possibility to separate or connect the source and the bulk in nLDMOS.

YJ Kim, MagnaChip’s Chief Executive Officer, commented, “Our 0.35 micron 700V UHV technology provides our foundry customers with a high-performance, highly efficient manufacturing process for AC-DC converter ICs and LED driver ICs for various LED lighting applications.” Mr. Kim added, “To meet the diverse customer requirements, MagnaChip will continue to develop new UHV technologies such as customer-specific UHV processes with additional option devices.”

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,300 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., Sept. 11, 2017 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today it will host its annual Foundry Technology Symposium at Sheraton Hsinchu Hotel, Taiwan, on October 25th, 2017.

The Foundry Technology Symposium will showcase MagnaChip’s latest technology offerings and provide a wide-ranging overview of MagnaChip’s manufacturing capabilities, specialty technologies, target applications and end-markets. In addition, MagnaChip plans to discuss current and future semiconductor foundry business trends, and provide insights into key end markets.

At the Symposium, MagnaChip will showcase its proprietary foundry technology used by customers to help enable the design and production of:
• Mixed-Signal for audio ICs, fingerprint sensor ICs, microphone MEMS ASIC, sensor ICs, RF switch/tuner and LNA for smartphones,
tablets, and IoT devices
• BCD (Bipolar CMOS DMOS) and Hybrid (BCD integrated with Non Volatile Memory) processes for PMIC, DC-DC, PoE, USB PD,
LED driver ICs, IoT, industrial and automotive applications
• Embedded NVM for MCUs, touch ICs, auto focus ICs, security ICs and UHV (Ultra High Voltage) for LED lighting, AC-DC

Technical experts and customer-facing representatives from MagnaChip will highlight the Company’s customer-friendly design environment.

“We are pleased to host our 2017 Foundry Technology Symposium in Taiwan,” said YJ Kim, Chief Executive Officer of MagnaChip. “We will offer attendees an opportunity to better understand how our foundry offerings and specialty technologies may be used to develop high-performance products targeted to high-growth markets.”

More than 120 fabless companies, IDMs (Integrated Device Manufacturers) and other semiconductor companies are expected to attend the symposium. To register for MagnaChip’s 2017 Foundry Technology Symposium in Hsinchu, and for further details regarding the event, please visit www.magnachip.com or ifoundry.magnachip.com.

About MagnaChip Semiconductor
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,300 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., Sept. 5, 2017 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications, today announced that members of the executive management team will make an investor presentation at the 2017 Citi Global Technology Conference on Wednesday, September 6 at 8 am EDT. The conference is being held in New York City.

An audio webcast of the presentation can be heard live on the MagnaChip website at (www.magnachip.com). The webcast link can be accessed within the “Investors” section of the website, under the heading of “Investor Events” (http://investors.magnachip.com/).

A replay of the webcast will be available one hour after the conclusion of the presentation and will be accessible on the MagnaChip website until December 6, 2017.

About MagnaChip Semiconductor Corporation
MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with over 30 years of operating history, owns a portfolio of approximately 3,300 registered and pending patents, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

In the United States:
Bruce Entin
Investor Relations
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

MagnaChip Selected as Foundry Partner by ELAN Microelectronics For World’s First Fingerprint Sensor IC-Based Smartcard

SEOUL, South Korea and SAN JOSE, Calif., July 17, 2017 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications, announced today it was selected as a foundry partner by ELAN Microelectronics to manufacture the world’s first fingerprint sensor IC-based smartcard. The smartcard uses biometrics technology that provides secure identification to prevent credit card fraud, a severe and growing problem globally. The sensor-IC based smartcard will be manufactured utilizing MagnaChip’s 0.35 micron Mixed Signal Thick IMD manufacturing process technology.

The requirement for more precise, efficient and low-power ICs has increased dramatically, coinciding with the rise in importance of biometrics technology for a range of applications. Industry analyst Frost & Sullivan forecasts that the biometrics industry will grow at a CAGR of 17.4% from 2014 to 2019 and that fingerprint-based sensor ICs will comprise 66% of the market.

MagnaChip was selected as ELAN’s foundry partner primarily because of the company’s recognized specialized foundry capability, proven and reliable manufacturing processes with robust analog performance. MagnaChip’s current technologies for fingerprint sensor ICs include 0.35 micron, 0.18 micron 1.8V/3.3V and single 3.3V Mixed Signal technology processes. MagnaChip plans to expand its portfolio of manufacturing processes to include more advanced technologies such as its highly competitive 0.18 micron Slim Mixed Signal manufacturing process, which requires fewer mask layers than usual. MagnaChip’s manufacturing processes are well-suited for applications in fast-growing markets that require fingerprint identification, such as in the payment, medical, transportation and automobile industries.

“We hope that the collaboration between MagnaChip and ELAN will continue to produce innovative and high quality products for our customers,” said I. H. Yeh, ELAN’s Chief Executive Officer. “ELAN sees its continued strategic partnership with MagnaChip as a long-term benefit to ELAN and MagnaChip.”

YJ Kim, Chief Executive Officer of MagnaChip, commented, “We are very pleased to announce MagnaChip’s continued partnership with ELAN and the volume ramp of fingerprint sensor IC-based products utilizing our 0.35 micron Mixed Signal Thick IMD based process technology. This process is well-suited for smartcards, which require low power consumption. We will continue to develop high-performance and cost-effective fingerprint sensor IC technology solutions that meet the growing needs of our foundry customers.”

About ELAN Microelectronics
ELAN, a world leading Smart Human Interface Solution provider with a solid patent portfolio, has successfully integrated its capacitive multi-touch solution into Smartphone, Tablet PC, NB/Ultrabook, while Smart-3D Remote has been promoted into Smart TV & AIO PC, amongst other portable electronic devices. With its Smart-Touchscreen IC & Touchpad IC, ELAN is currently in strategic partnership with Intel in touchscreen controller development. ELAN has received many Win 8 & Win 10 Touch Logo Certifications from Microsoft& has been awarded with the “Best Choice of the Year” award twice by COMPUTEX TAIPEI 2009 & 2012. ELAN is also listed as one of the “Best Under a Billion 200 Companies” worldwide by Forbes Global Magazine.

About MagnaChip Semiconductor
MagnaChip is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with a 30-year operating history, owns a portfolio of more than 3,400 registered and pending patents, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., April 10, 2017 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it will host its Annual U.S. Foundry Technology Symposium at Hilton Santa Clara, California, on June 7th, 2017.

The primary purpose of the Foundry Technology Symposium is to showcase MagnaChip’s most up-to-date technology offerings and to provide an in-depth understanding of MagnaChip’s manufacturing capabilities, its specialty technology processes, target applications and end-markets. Furthermore, during the symposium, MagnaChip plans to discuss current and future semiconductor foundry business trends, and also cover presentations in key markets through guest speeches.

While providing an in-depth overview of its specialty processes, MagnaChip will also highlight its technology portfolio and its future roadmap, including technologies such as mixed-signal, which supports applications in the Internet of Things (IoT) and RF switch sector and Bipolar-CMOS-DMOS (BCD) for high-performance analog and power management applications. In addition, MagnaChip will also feature applications regarding Ultra-High Voltage (UHV), such as LED lighting and AC-DC chargers, and cover Non-Volatile Memory (NVM)-related technologies, such as Touch IC, Automotive MCUs and other customer specific applications. Furthermore, MagnaChip will present its technologies used in applications including smartphones, tablet PCs, automotive, industrial, LED lighting and the wearables segments. MagnaChip will also review its customer-friendly design environment and an on-line customer service tool known as “iFoundry.”

“We are very pleased to host MagnaChip’s Annual Foundry Technology Symposium in the US again this year,” said YJ Kim, Chief Executive Officer of MagnaChip. “We plan to offer participants an opportunity to better understand the foundry and the application market dynamics, and to provide insights into MagnaChip’s specialty process technologies.” MagnaChip has approximately 466 proprietary process flows it can utilize and offer to its foundry customers.

More than 100 fabless companies, IDMs (Integrated Device Manufacturers) and other semiconductor companies are expected to attend the event. To sign up for MagnaChip’s Annual Foundry Technology Symposium in Santa Clara and for more details regarding the symposium, please visit www.magnachip.com or ifoundry.magnachip.com.

About MagnaChip Semiconductor
MagnaChip is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high-volume consumer, communication, industrial and computing applications. The Company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide. MagnaChip, with a 30-year operating history, owns a portfolio of more than 3,400 registered and pending patents, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip’s website is not a part of, and is not incorporated into, this release.

CONTACTS:

In the United States:
Bruce Entin
Entin Consulting
Tel. +1-408-625-1262
Investor.relations@magnachip.com

In Korea:
Chankeun Park
Director of Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and SAN JOSE, Calif., March 13, 2017 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers a new 0.18 micron RFSOI process with enhanced switching performance. Compared to the previous 1.5/2.5V process, this new switch-centric process created specifically for 2.5V reduces manufacturing cost and time-to-market while providing competitive and superior performance for antenna switches used in mobile and Internet-of-Things devices for wireless connectivity.

There are several benefits to using the new 0.18 micron 2.5V RFSOI process. The primary benefit is that it is a cost effective process. It offers a 150fs of Ron*Coff using aluminum for metal1 and reduces the number of photo steps by approximately 15% as compared to the industry standard by one poly silicon layer and four metal layers (1P4M). By reducing the number of mask layers, customers will reduce costs and improve their time-to-market with a shorter turnaround time in the fab. Ron*Coff is a figure of merit used to rate the performance of an RF switch.

Another important benefit is that it has robust breakdown at above 4V while also maintaining Ron*Coff at 150fs. Through high BV (Breakdown Voltage), the stack number of switch is reduced, resulting in chip size reduction.

Furthermore, the new 0.18 micron RFSOI process reduces insertion loss by 20% at 2GHz and low harmonics of better than -60dBm at 35dBm power level. This process, which has successfully been demonstrated with an SP8T (Single Pole Eight Throw) switch, builds on a trap-rich, high-resistivity substrate to suppress harmonic distortion. It also provides additional transistors with useful options such as floating body, low leakage, and enables a reduction in area of approximately 18%, from our previous process, for the integration of multiple RF and analog functions onto a smaller die. Available process options also include a 27-volt metal-inductor-metal capacitor, geometry scalable inductor, high resistivity poly resistor, MOS varactor, and up to 4 layers of metal with 4-micron thick top metal for rich power handling.

“The addition of the switch-centric 2.5V process to our RFSOI technology portfolio is another example of MagnaChip’s strong commitment to our foundry customers, who continually desire cost-competitive and high-performing RFSOI processes,” said YJ Kim, Chief Executive Officer of MagnaChip. Mr. Kim also added that “We will continue to offer differentiated processes and expand our RFSOI process offerings to meet the growing and highly specific technology requirements of our global customer-base.”

About Maganachip Semiconductor

Maganachip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications. The Company provides a broad range of standard products to customers worldwide. With more than 40 years of operating history, Maganachip owns a portfolio of approximately 1,200 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. Please visit www.Maganachip.com for more information. Information on or accessible from Maganachip’s website is not a part of, and is not incorporated into, this release.

CONTACTS: