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SEOUL, South Korea and CUPERTINO, Calif., Oct. 21, 2013 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it now offers a new 0.35um silicon-on-insulator (SOI) based Bipolar-CMOS-DMOS (BCD) high voltage process. This new process features 8V to 16V fully isolated high voltage devices that are implemented on SOI substrates for applications that include audio amps, DC-DC converters, and PMICs for the mobile and consumer markets.

This process also supports standard 3.3V and 5V CMOS digital, mixed-signal and analog devices. The high voltage 8V to 16V devices are optimized to have low Rsp (specific on-resistance) and low capacitance, for applications requiring power stages. Integrating CMOS and high voltage devices on SOI substrates with deep trench isolation (DTI) offers minimum isolation and device area, minimum substrate leakage, improved radiation hardness and high-temperature operation. This enables the design of PMICs with unipolar or bipolar supplies (positive and negative supply rails), with latch-up free operation.

“We are very pleased to offer our new 0.35um BCD high voltage process solution based on silicon-on-insulator substrates,” said Namkyu Park, Senior Vice President of Marketing for MagnaChip’s Semiconductor Manufacturing Services Division. “We intend to expand our SOI based BCD portfolio with additional voltage ratings to continue to support the growing applications that can benefit from the isolation feature of this process.”

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and CUPERTINO, Calif., Sep. 3, 2013 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it now offers a new 0.18um embedded Bipolar-CMOS-DMOS (eBCD) technology. This new process features BCD high voltage power devices embedded into a 0.18um standard logic process. The advantages of this new BCD process include minimal mask additions and support of high voltage ranges (12V~30V), which make the process well suited for applications such as PMICs, DC-DC converters and regulators, low-distortion audio amplifiers, and battery management ICs for the mobile and consumer markets.

This new BCD process is fully compatible with standard CMOS processes and uses high density logic devices (1.8V) and high performance analog devices (5V) with industry-leading low flicker noise. This process will support premium features available on standard logic processes, including multiple time programmable memory (MTP), one time programmable memory (OTP), fuse-based trim capabilities, high K metal-insulator-metal capacitors, copper wire bonding compatibility, thick low-cost aluminum top metallization, and low-cost redistribution layer (RDL) process options.

High-performance 12V to 30V Lateral-DMOS power devices are fully isolated from the substrate and features low Rsp (specific on resistance) for the applications where power device area and efficiency are critical. The isolation of the high voltage devices from the substrate is achieved without the use of costly epitaxial layers and buried layers, and sacrificing latch-up performance while minimizing substrate injection.

“We are very pleased to offer our new 0.18um embedded BCD process solution with features that support 12~30V power applications while minimizing manufacturing processing costs,” said Namkyu Park, Senior Vice President of Marketing for MagnaChip’s Semiconductor Manufacturing Services Division. “Our modular based BCD process enables us to quickly support our customers’ unique manufacturing requirements for a variety of high voltage applications in a very timely fashion.”

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and CUPERTINO, Calif., July 25, 2013 /PRNewswire/ —

Featured Highlights:
Enhanced navigation and augmented reality applications for smartphones and tablets
New 0.18 micron e-Compass provides high performance and industry-standard heading accuracy
Broad range of software, hardware and OEM partner support

The e-Compass is an important sensor for smartphones and tablets as it maintains alignment of the display with the user’s orientation. As smartphones and tablets increasingly utilize navigation and augmented reality features, the e-Compass market is expected to grow in measure with the growth of smartphone and tablet production. A recent report from the Gartner Group shows smartphone production having grown by a CAGR of 61.6% from 2009 to 2012. By introducing the MXG1300, MagnaChip enters this emerging and growing market equipped with its own high-volume 8-inch wafer manufacturing capability combined with a Korea-based “end-to-end” ecosystem.

The MXG1300 e-Compass offers an attractive design solution featuring an Android OS driver, compass algorithms, and magnetic field scanning support. Field scanning support helps determine an optimum location for the MXG1300 chip placement within a cellphone, since the e-compass operation is subject to magnetic interference from a vibration motor and speakers. MXG1300 provides an industry-competitive wide dynamic range of magnetic field strength and cost-effectiveness. Additional features of the MXG1300 are its low noise mixed signal and analog process technology as well as a 16-bit sigma-delta ADC (analog-digital converter).

In addition, the MXG1300 has a low-power mode which reduces operating current by 40% in situations where it is possible to operate the device at a slower, but acceptable, heading speed. This mode creates wider power management flexibility by extending the battery life of mobile devices.

“We believe the timing is right to launch the MXG1300 e-Compass sensor series as the market is demanding a more cost effective solution,” said YJ Kim, Executive Vice President and General Manager of MagnaChip’s Display Solutions Division. “With the advantage of our own proprietary 0.18 micron process technology and available capacity at our cost competitive fab, MagnaChip will continue to provide the consumer with constantly evolving e-Compass solutions, a key element of MagnaChip’s expanding technology and product roadmap.”

Pricing and Availability
MXG1300 e-Compass is currently being sampled and will go to production in Q3 2013. Evaluation kit is available through MagnaChip sales channels.

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-3-6903-3195
chankeun.park@magnachip.com

New intelligent sensors will make Smartphones, Tablets, Automobile Dashboards, Medical Equipment and other products more user-friendly and responsive

SEOUL, South Korea and CUPERTINO, Calif., July 25, 2013 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korean semiconductor company with a broad portfolio of analog and mixed-signal products and technologies, today announced a full range of “MXsensor™” intelligent sensor product families featuring 0.18 micron mixed signal & analog technology with low power consumption. The MXsensor™ families target the growing market for applications ranging from smartphone, tablet, and navigation to medical devices. The MXsensor™ families include e-Compass and digital Hall sensors. MagnaChip’s intelligent sensors provide cost-effective features such as small form-factor and multi-function integration as a result of its use of 0.18 micron mixed signal & analog technology and advanced design capabilities, as compared to currently available products.
Sensors are used for many applications and their use is growing rapidly. Furthermore, today’s increasingly sophisticated devices require an emerging class of intelligent sensors in mass volume. For instance, in handheld devices magnetic sensors are essential to implement compass-functionality and to detect the timing of opening and closing of a flip cover. MagnaChip’s intelligent sensor families address these magnetic sensor requirements with a new style of design made possible by integrating multiple functions and lowering power consumption utilizing MagnaChip’s own proprietary 0.18 micron mixed-signal technology.

MagnaChip is charging ahead with its new 0.18 micron design in its target market segments, as the sensor industry as a whole needs to move to a more cost-effective smart sensor solution in order to meet lower cost and product differentiation objectives in areas such as smartphones. Several factors make the smartphone market particularly compelling for this new intelligent design.

A recent report from the Gartner Group shows smartphone production growing by a CAGR of 61.6% from 2009 to 2012 with unit production continuing to increase due to emerging manufacturers and the growth of 4G / LTE networking. To make smartphones more attractive to consumers, design teams are turning to sensors as one way to differentiate their models by incorporating more user friendly interfaces and an overall better user experience.

According to another recent report issued by Gartner Group, the non-optical sensor market will be growing by a CAGR of 12.1% from 2012 to 2017, which is partially attributed to the increasing number of sensors inside a mobile phone. For models manufactured in 2013, there are typically 12~13 sensors in a smartphone.

The MXsensor™ families include:

MXM11XX Digital Hall Sensor Family
This fully-digitalized Hall sensor features 10-bit ADC (analog-digital converter) and programmable design flexibility. It presents numerous new functionalities over alternatives of conventional Hall switches. The self-calibration mode allows high-precision applications with an inexpensive magnet, while the I2C interface enables device makers to quickly provide value-added features through creative programming. Please see today’s accompanying press release for more information about this product.

MXG1300 e-Compass Sensor Family
This new e-Compass features both industry-comparable heading accuracy and power performance with MagnaChip’s proprietary magnetic Hall sensor technology. The heading accuracy can enhance the user experience even under harsh magnetic-flux environments, while the better power performance extends battery life time for power-hungry mobile devices. Please see today’s accompanying press release for more information about this product.
“MagnaChip’s new MXsensor™ solutions are already creating great interest, particularly in the mobile device manufacturing sector,” said YJ Kim, Executive Vice President and General Manager of MagnaChip’s Display Solutions Division. “We look forward to meeting the needs of the smartphone and tablet communities and other industry sectors with the advanced feature set of the MXsensor™ series through our rapidly growing list of advanced product offerings.”

Availability
MXM11XX and MXG1300 families are currently being sampled and will go into production in Q3 2013. Evaluation kits are available through MagnaChip sales channels.

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-3-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and CUPERTINO, Calif., July 22, 2013 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and the National Nano Fab Center (“NNFC”) have entered into an SOI RF CMOS technology transfer agreement which combines MagnaChip’s specialty manufacturing expertise with NNFC’s robust RF technology. The two companies have targeted expansion into the emerging RF front-end module (“FEM”) foundry market.

The technology agreement transfers 0.18um SOI RF CMOS process technology to MagnaChip. This process technology is a core component of cellular phone FEMs. FEMs can replace existing compound semiconductor and silicon solutions with approximately 30% reduced manufacturing process steps. This reduces manufacturing cost, accelerates time to market, while addressing the specific needs of 2/3/4G and LTE cellular systems.

The SOI RF CMOS technology is optimized for use in RF switches and antenna tuning applications, which have rapidly expanded as a result of the recent development trends in multiband and multimode cellular phone designs. In addition to offering excellent switch performance, this technology enables a high level of integration including control, logic, monitoring and power. The resulting FEMs are lighter, thinner, smaller compared to FEMs using compound semiconductor and can be integrated with digital tunable capacitors, which are key elements of RF tuning circuits. As we look further into the future, FEMs may eventually be integrated with power amplifiers, leading to a single-chip CMOS FEM solutions.

Jae Young Lee, President of NNFC commented, “This technology transfer is an example of the successful technology development work done at NNFC which can be applied to commercial production. NNFC, which is a government-sponsored R&D center, uniquely defined this technology platform. Going forward, NNFC will continue to lend its support to MagnaChip to ensure the continued success of the SOI RF CMOS foundry process technology.”

“The technology transfer of NNFC’s 0.18um SOI RF CMOS is a significant addition to MagnaChip’s growing list of process offerings that are available to its specialty foundry customers,” said Namkyu Park, Senior Vice President of Marketing for MagnaChip’s Semiconductor Manufacturing Services Division. “Our goal is to continue to offer the latest in differentiated technologies to meet the needs of our customers and partners in the fast-changing semiconductor market.”

About National Nano Fab Center
NNFC is the public institute invested by central, local government and KAIST (Korea Advanced Institute of Science and Technology) in Korea. The main mission is to provide and offer fabrication services to academia, research institutes and industry. NNFC has a nano-fusion infrastructure based on CMOS, MEMS, BIO-MEMS, NANO Materials and Analysis division. For more information, please visit www.nnfc.re.kr.

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest ranges of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and CUPERTINO, Calif., May 20, 2013 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that it will host its 2013 Foundry Technology Symposium in Hsinchu, Taiwan, on Thursday, June 13, 2013.

The purpose of the annual foundry symposium is to provide participants an in-depth understanding of MagnaChip’s manufacturing services (foundry) business, its specialty technology processes, target applications and end-markets, as well as current and future semiconductor foundry trends.

MagnaChip will provide an in-depth overview of its specialty process technologies and will highlight its technology portfolio and roadmap including technologies such as mixed-signal, BCD and non-volatile memory used in applications such as smartphones, tablet PCs, and automotive. MagnaChip will also review its on-line customer service tool known as “iFoundry”.

“We are very pleased to host MagnaChip’s 3rd Foundry Technology Symposium in Taiwan again this year,” said Namkyu Park, Senior Vice President of Marketing for MagnaChip’s Semiconductor Manufacturing Services Division. “We are planning to offer the many participants with an opportunity to better understand the foundry market dynamics as well as provide insights into MagnaChip’s specialty process technologies.”

More than one hundred fabless and other semiconductor companies are expected to attend the technology symposium in Hsinchu. To sign up for MagnaChip’s 3rd Annual Foundry Technology Symposium in Hsinchu and for more details, please visit www.magnachip.com or ifoundry.magnachip.com.

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SOURCE MagnaChip Semiconductor Corporation

SEOUL, South Korea and CUPERTINO, Calif., May 7, 2013 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that it has broadened its line-up of high voltage options for its 0.18um embedded EEPROM process technology. In addition to 10V and 20V high voltage options, MagnaChip has successfully integrated a 30V option for its 0.18um embedded EEPROM technology. This additional high voltage option provides increased noise immunity by improving the signal-to-noise ratio characteristics of devices, a critical issue in touch sensing IC performance. This is especially true in applications such as smartphones, tablet PCs, notebooks, and smart TVs.

The latest trend in smartphone and tablet PC touch sensing applications has been a move toward thinner yet larger designs. This trend often makes the electronic circuitry more susceptible to internal and external electrical noise. The various sources of noise, particularly in mobile devices, include the close proximity of various semiconductor components within the system, battery chargers and even external factors such as temperature and humidity. Unwanted electrical noise can generate spurious signals creating false touches in the sensing circuitry.

MagnaChip’s process technology enhances the functionality and performance of these newer IC designs by improving their signal-to-noise characteristics. MagnaChip’s newly developed 30V process is ideally suited for the larger screen mobile applications that are now being introduced. This new process was developed utilizing a lateral double-diffused MOS structure with sustained performance up to 30V.

“We are very pleased to be able to offer a broad array of high voltage options for our enhanced 0.18um embedded EEPROM process technology,” said Namkyu Park, Senior Vice President of Marketing for MagnaChip’s Semiconductor Manufacturing Services Division. “Our goal is to continue to develop competitive features that meet the increasing application specific needs of our foundry customers in the fast-changing semiconductor market.”

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel.+1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SOURCE MagnaChip Semiconductor Corporation

SEOUL, South Korea and CUPERTINO, Calif., May 1, 2013 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that management will be presenting and discussing the company’s growth opportunities and strategies at the J.P. Morgan 41st Annual Technology, Media and Telecom Conference in Boston, Massachusetts.

The presentation is scheduled for May 15, 2013 at 3:30 p.m. Eastern Time and will be webcast live and archived on MagnaChip’s investor relations website at www.magnachip.com.

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SOURCE MagnaChip Semiconductor Corporation

– May 16th in Santa Clara, California
– May 21st in Austin, Texas

SEOUL, South Korea and CUPERTINO, Calif., April 15, 2013 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that it will host its 2013 Foundry Technology Symposium with a kickoff in Santa Clara, Calif., on Thursday, May 16, 2013.

The annual foundry symposium will also be hosted in Austin, TX on May 21, 2013, with the purpose of providing participants an in-depth understanding of MagnaChip’s manufacturing services (foundry) business, its specialty technology processes, target applications and end-markets, as well as current and future semiconductor foundry trends.

MagnaChip will provide an in-depth overview of its specialty process technologies and will highlight its technology portfolio and roadmap including technologies such as mixed-signal, BCD, ultra-high voltage and non-volatile memory. In addition, MagnaChip will discuss applications such as smartphones, tablet PCs, and automotive. MagnaChip will also review MagnaChip’s design environment and on-line customer service tool known as “iFoundry”.

“We are very pleased to host MagnaChip’s 3rd Annual Foundry Technology Symposium in the United States again this year,” said Namkyu Park, Senior Vice President of Marketing for MagnaChip’s Semiconductor Manufacturing Services Division. “We are planning to offer the many participants with an opportunity to better understand the foundry market dynamics as well as provide insights into MagnaChip’s specialty process technologies.”

More than one hundred fabless and other semiconductor companies are expected to attend the technology symposiums in Santa Clara and Austin. To sign up for MagnaChip’s 3rd Annual Foundry Technology Symposium and for more details, please visit www.magnachip.com or ifoundry.magnachip.com.

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:

Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:

Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

Sidense Qualifies 1T-OTP Non-Volatile Memory for MagnaChip 180nm Mixed-Signal and HV CMOS Process

— 1T-OTP available in high-voltage CMOS process for a wide range of applications including LED lighting, power management and display controllers

OTTAWA, Ontario, SEOUL, South Korea and CUPERTINO, Calif., March 25, 2013 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) one-time programmable (OTP) memory IP cores today announced that Sidense’s SLP 1T-OTP macros have been fully qualified for MagnaChip’s 180nm 1.8/3.3/18V high voltage CMOS and mixed-signal process. Semiconductor devices fabricated in these processes are used in applications such as LED lighting controllers, display controllers and power-management ICs (PMICs) for mobile and other high-volume applications.

“Leading semiconductor device manufacturers are already using Sidense 1T-OTP macros for LED energy management solutions fabricated using MagnaChip’s leading process technology,” stated Tom Schild, Sidense’s VP of Worldwide Sales and Marketing. “By offering our very dense and low-power SLP memory macros in MagnaChip’s HV process, customers have a proven platform in which they can take full advantage of the benefits of 1T-OTP memory and its cost-effectiveness, reliability and security advantages over eFuse, mask ROM and other NVM technologies.”

“Qualifying Sidense’s SLP 1T-OTP memory macros in our high-voltage and mixed-signal processes with high performance analog devices such as low noise and multi Vt transistors allows us to provide our key customers with significant benefits in performance and die area savings as well as long term reliability at high temperatures,” said Namkyu Park, Senior Vice President of Marketing for MagnaChip’s Semiconductor Manufacturing Services Division. “By using MagnaChip’s specialized process technology with Sidense’s reliable and cost-effective non-volatile memory macros, customers can bring to market products that offer distinct advantages over those of their competitors having flexible analog trimming and/or control program storage.”

Sidense SLP
SLP macros are available in a comprehensive range of off-the-shelf configurations ranging from 128 bits for trim and configuration applications up to 256 Kbits per macro for code storage and multiple NVM uses. Benefits of Sidense’s SLP OTP include small footprints to minimize cost, low power consumption, field-programmability, available configurations with word widths up to 128 bits and fast read access to allow executing code from OTP for many applications.

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

About Sidense Corp.
Sidense Corp. provides secure, very dense and reliable non-volatile, one-time programmable (OTP) memory IP for use in standard-logic CMOS processes with no additional masks or process steps required. The Company’s innovative one-transistor 1T-Fuse™ architecture provides the industry’s smallest footprint, most reliable and lowest power Logic Non-Volatile Memory (LNVM) IP solution. With over 100 patents granted or pending, Sidense OTP provides a field-programmable alternative solution to Flash, mask ROM and eFuse in many OTP and MTP applications.

Sidense SiPROM, SLP and ULP memory products, embedded in more than 250 customer designs, are available from 180nm down to 28nm and are scalable to 20nm and below. The IP is offered at and has been adopted by all top-tier semiconductor foundries and selected IDMs. Customers are using Sidense OTP for analog trimming, code storage, encryption keys such as HDCP, WHDI, RFID and Chip ID, medical, automotive, and configurable processors and logic. For more information, please visit www.sidense.com.

Media Contacts:

Sidense
Susan Cain
Cain Communications for Sidense
Tel: 503-538-2747
Email: scain@caincom.com

Jim Lipman
Sidense
Tel : 925-606-1370
Email: jim@sidense.com

MagnaChip – United States
Robert Pursel
Director of Investor Relations
Tel: 408-625-1262
Email: robert.pursel@magnachip.com

MagnaChip – Korea
Chankeum Park
Senior Manager, Public Relations
Tel: 82-2-6903-3195
Email: chankeun.park@magnachip.com