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MagnaChip to Offer 0.35um Ultra-High Voltage BCD Process Technology for Integrated Smart Energy Applications

SEOUL, South Korea and CUPERTINO, Calif., March 4, 2013 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it now offers a 0.35-micron ultra-high voltage 700V BCD (Bipolar/CMOS/DMOS) process technology targeted at the growing smart energy market for applications such as AC-DC and switched-mode power supplies as well as LED lighting.

The ultra-high voltage 700V BCD technology enhances performance by significantly lowering conduction and switching losses. This feature is accomplished by combining dual gate CMOS (3.3/5.5V) integration technology with two medium voltage (20/40V) LDMOS and ultra-high voltage (700V) applications in a single process. The new ultra-high voltage (700V) process will include JFET and depletion mode LDMOS for start-up and low on resistance LDMOS for power devices.

This new process enables foundry customers to design a cost competitive and highly reliable one-chip solution that integrates a DC-DC controller and a start-up function together with high density CMOS. The ultra-high voltage LDMOS sustains a breakdown voltage up to 800V while maintaining a low specific on resistance. It also provides customers with design flexibility by allowing the selection of either a JFET or depletion-mode LDMOS start-up device depending on cut-off voltage and current handling requirements.

This new BCD 700V technology also supports MagnaChip’s various process module options such as 20V parasitic NPN/PNP BJT, high resistance poly, Zener diodes, poly fuse, and high voltage ESD protection. This new high-voltage process is scheduled to be available by June 2013

“We are very pleased to offer our ultra-high voltage 700V BCD technology to meet the growing global demand for smart energy products. Our new 700V BCD process will provide foundry customers with increased design flexibility and integration to address the broad spectrum of design complexity and end market requirements,” said Namkyu Park, Senior Vice President of Marketing for MagnaChip’s Semiconductor Manufacturing Services Division. “Our goal is to continue to provide advanced process solutions for the application-specific needs of our foundry customers.”

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-3-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and CUPERTINO, Calif., Feb. 13, 2013 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and ELAN Microelectronics (“ELAN”), a leading fabless provider of touch solutions for mobile phone and PC applications, today announced that they have begun to ramp production of ELAN’s EEPROM touchpad products utilizing MagnaChip’s advanced 0.18um manufacturing process technology.

MagnaChip’s 0.18um EEPROM process features a patented side-wall selective transistor cell (SSTC) structure driving multiple voltage levels from 1.8V, 1.8V+3.3V and 1.8V+5.0V. This advanced manufacturing process developed by MagnaChip provides a significantly reduced cell size that translates into a very cost-effective NVM technology solution with enhanced performance for foundry partners such as ELAN.

Namkyu Park, Senior Vice President of Marketing for MagnaChip’s foundry division commented, “We are very pleased to announce MagnaChip’s continued partnership with ELAN and the ramp of their touchpad products utilizing our advanced 0.18um EEPROM process technology. This process is ideally suited for mobile as well as PC applications such as notebooks and ultrabooks. We will continue to develop high-performance and cost-effective embedded EEPROM technology solutions that meet the growing needs of our foundry customers.”

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

About ELAN Microelectronics
ELAN, a world leading Smart Human Interface Solution provider with solid patents portfolio, has successfully integrated its capacitive multi-touch solution into Smartphone, Tablet PC, NB/Ultrabook, while Smart-3D Remote has been promoted into Smart TV & AIO PC, amongst other portable electronic devices. With its Smart-Touchscreen IC & Touchpad IC, ELAN is currently in strategic partnership with Intel in touchscreen controller development. ELAN has received many Win 8 Touch Logo Certifications from Microsoft& has been awarded with the “Best Choice of the Year” award twice by COMPUTEX TAIPEI 2009& 2012. ELAN is also listed as one of the “Best Under a Billion 200 Companies” worldwide by Forbes Global Magazine.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
ChankeunPark
Senior Manager, Public Relations
Tel.+82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and CUPERTINO, Calif., Jan. 7, 2013 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers a second generation 0.35-micron BCD (Bipolar/CMOS/DMOS) high voltage process technology. This next generation process supports applications from 3.3V to 65V making it ideally suited for DC-DC converters and regulators, Power-over-Ethernet, LED drivers, level shifters, audio amplifiers, AC-DC controllers and converters, micro-converters and micro-inverters, as well as PMICs for the mobile and consumer markets.

This second generation 0.35-micron BCD process features high-voltage MOSFETs with 20~35% lower specific on resistance (Rsp) than the previous generation, achieved through process and device structure optimization. IC designs typically require a broad range of voltage schemes and reliability requirements. This new BCD process features an option to select DMOS devices which best optimize Rsp values for scaled reliability levels.

Besides featuring a lower Rsp, MagnaChip’s proprietary deep-trench isolation technology yields about a five times smaller DMOS isolation area and much improved latch-up immunity, compared to conventional junction isolation approaches. With the combination of lower Rsp, improved isolation and higher reliability, this next generation 0.35-micron BCD process will provide our foundry customers with smaller and higher performance products

This new BCD process technology supports MagnaChip’s various process module options which enhance design flexibility and cost effectiveness. These options include multi-time programmable (MTP) and high-reliability non-volatile memory cells, one-time programmable (OTP) cells, high capacitance per unit area, metal-insulator-metal capacitor, copper wire bonding, thick top metal, and redistribution layer process options.

“We are very pleased to offer our next generation 0.35um BCD high voltage process solution optimized for the fast growing mobile and consumer markets,” said Namkyu Park, Vice President of Marketing for MagnaChip’s foundry division. “As a specialty foundry, our goal is to continue to introduce process technology enhancements for our foundry customers that improve the performance and cost effectiveness of their products.”

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

MagnaChip Contacts:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeum Park
Senior Manager, Public Relations

Tel. +82-2-6903-3195
chankeun.park@magnachip.com

MagnaChip to Present and Discuss Growth Opportunities and Strategies at the 15th Annual Needham Growth Conference

SEOUL, South Korea and CUPERTINO, Calif., Jan. 3, 2013 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that management will be presenting and discussing the company’s growth opportunities and strategies at the Needham 15th Annual Growth Conference in New York City.
The presentation is scheduled for January 15, 2013 at 11:20 a.m. Eastern Time and will be webcast live and archived on MagnaChip’s investor relations website at www.magnachip.com.

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SEOUL, South Korea and HEIDENHEIM, Germany, Dec. 12, 2012 – MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacture of analog and mixed-signal semiconductor products, today announced that it has entered into a sales distribution agreement with INELTEL GmbH, a Germany-based distributor of advanced semiconductor products and services in Europe.

INELTEK, a leading European distributor, offers an extensive range of semiconductor products with a tradition of exceptional technical support and engineering services. INELTEK’s wide distribution network includes sales and support offices in eight countries as well as individualized on-site customer assistance. Under the terms of the agreement, INELTEK will distribute MagnaChip’s power semiconductor products throughout Europe providing MagnaChip with access to new high growth markets and customers.

“This relationship is an excellent opportunity for both companies to increase their market share of semiconductor products in Europe and to gain access to new markets. Furthermore, we are able to provide additional products in the category of analog and mixed-signal semiconductors to our blue chip customer base, “said Bernhard Sonnentag, INELTEK’s Managing Director

“We are very pleased to add INELTEK GmbH to our distribution network in Europe,” said Brent Rowe, MangaChip’s Executive Vice President of worldwide sales. “INELTEK’s extensive customer network and application expertise is very complementary to MagnaChip’s growing portfolio of power semiconductor solutions.”

About INELTEK GmbH
Since INELTEK’s formation in 1987, the company has grown rapidly and continues to expand as a specialized distributor of electronic components. INELTEK commenced operations in Germany and has expanded across Europe and USA. Through these offices, INELTEK offers a highly competent level of technical support to their customers. The warehouse and logistics are centralized in Germany where INELTEK can supply prompt delivery along with such services as Kanban, consignment warehousing and just in time (JIP) deliveries. For more information, please visit www.ineltek.com.

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacture of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

MagnaChip contacts:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
Robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

INELTEK Contact:
Bastian Strassburg
Marketing Manager
Tel. +49-7321-9385-0
strassburg@ineltek.com

SEOUL, South Korea and CUPERTINO, Calif., Dec. 3, 2012 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that it has partnered with eMemory Technology, Inc. of Taiwan in the development of leading edge 0.18um EEPROM intellectual property (IP). By adding eMemory’s advanced EEPROM IP to MagnaChip’s existing non-volatile memory (NVM) IP portfolio, MagnaChip can provide enhanced foundry services for its global customers requiring high-performance embedded NVM IC design solutions.

MagnaChip’s 0.18um EEPROM process implements world-class cell size by using its patented side-wall selective transistor cell (SSTC) structure driving multiple voltage levels from 1.8V, 1.8V+3.3V and 1.8V+5.0V. The joint development of advanced NVM IP with eMemory enhances MagnaChip’s existing 0.18um EEPROM IP portfolio. eMemory is a recognized leader in embedded NVM IP design and the joint development program will provide additional embedded NVM solutions for MagnaChip’s customers. MagnaChip and eMemory have completed initial process review with IP design and qualification targeted for 2013.

eMemory’s EEPROM IP is ideally suited for touch IC applications which have seen significantly increased adoption in consumer and communication products. The jointly developed NVM IP will enable higher speed performance with lower power consumption while also allowing operations at a wider temperature range. Both companies are targeting specifications that include more than 10 years of data retention and endurance characteristics of over 100,000 fail-safe transactions.

“MagnaChip and eMemory have, for many years, established a successful collaboration on the application of the OTP process platform. Now, to extend from this productive cooperation, MagnaChip and eMemory will further collaborate on implementing the OTP and EEPROM IP to broaden the application of embedded non-volatile memory technology and its product lines, advancing industrial synergy to a higher level. This fruitful collaboration will create a win-win situation for eMemory, MagnaChip and their customers, and consequently strengthen their leadership role in the market,” said Rick Shen, President of eMemory Technology.

“We are very pleased to be engaged in a joint-development project with eMemory, a leading edge Taiwanese EEPROM IP provider, said Namkyu Park, Vice President of Marketing for MagnaChip’s foundry division. “This partnership will enable MagnaChip to provide more NVM solutions as part of its continued effort to offer cost-effective and size-competitive embedded EEPROM IP solutions to meet the application-specific needs of our foundry customers.”

About eMemory
eMemory was established in August, 2000, and has focused on logic process eNVM silicon IP development. Since its establishment, eMemory has participated in research and development of innately innovative technologies, developing leading products like NeoBit (OTP and MTP silicon IP), NeoFlash (10,000+ times programmable silicon IP), NeoEE (100,000+ times programmable silicon IP) and NeoMTP (1,000+ times programmable silicon IP). eMemory continues to develop advanced technologies, striving to provide customers with silicon IP services, NVM components, and embedded memory applications having broad application scope, and is a full-service provider of eNVM silicon IPs. eMemory currently has about 200 employees, and is traded on the Taiwan’s GreTai Securities Market (Stock code: 3529).

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

MagnaChip Contacts:
In the United States:
Robert Pursel
Director of Investor Relations
Tel. +1-408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

MagnaChip and Peregrine Semiconductor Expand Production of
STeP5 UltraCMOS® RFIC and DuNE™ DTC Tuning Products

SAN DIEGO, California and SEOUL, South Korea, Nov. 19, 2012 — MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and Peregrine Semiconductor Corporation (NASDAQ: PSMI), a fabless provider of high-performance radio frequency integrated circuits (RFICs), today announced that MagnaChip has expanded production of Peregrine Semiconductor’s STeP5 UltraCMOS® technology-based RFIC product line, including the most recent DuNE™ Digitally Tunable Capacitors (DTCs) for RF impedance tuning. Peregrine Semiconductor and MagnaChip announced the final qualification and high-volume production ramp of the “STeP5” UltraCMOS process in the third calendar quarter 2011. Due to the continued increase in orders for the STeP5 products, MagnaChip fulfilled the fastest manufacturing ramp in Peregrine Semiconductor’s history.

Current generations of UltraCMOS, an advanced form of Silicon-on-Insulator technology, utilize a sapphire substrate, which enables high levels of monolithic integration, and results in smaller die, higher yields, and fewer external components than other competing compound semiconductor processes. Distinctive generations of the UltraCMOS process are released in “STePs.” The STeP5 products are produced at MagnaChip’s Cheongju, South Korea facility, where MagnaChip also manufactures Peregrine’s legacy “STeP3” and “STeP4” UltraCMOS devices in high volume.

“It is important for MagnaChip to engage with partners who are solving the RF-design challenges associated with the latest 4G LTE networks, and Peregrine Semiconductor is one of those partners,” said Namkyu Park, vice president of marketing for MagnaChip’s foundry division. “We are pleased with the successful ramp and rapid expansion of the STeP5 UltraCMOS product line, including the DuNE DTCs for RF impedance matching. MagnaChip’s manufacturing expertise, combined with our customers’ design capabilities, will allow us to continue to provide robust and cost-competitive manufacturing solutions to our customers.”

“MagnaChip has provided excellent support and flexibility in ramping to meet the large demand for our STeP5 UltraCMOS products,” said Ian Warbrick, vice president of operations for Peregrine Semiconductor. “They added capacity very quickly, and processed a large volume of wafers with expedited cycle times, enabling us to meet our customers’ expectations.”

About Peregrine Semiconductor
Peregrine Semiconductor (NASDAQ: PSMI) is a fabless provider of high-performance radio frequency integrated circuits (RFICs). Our solutions leverage our proprietary UltraCMOS® technology, an advanced RF Silicon-On-Insulator process. Our products deliver what we believe is an industry-leading combination of performance and monolithic integration, and target a broad range of applications in the aerospace and defense, broadband, industrial, mobile wireless device, test and measurement equipment, and wireless infrastructure markets. Additional information is available on the Company’s website at http://www.psemi.com.

About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise. For more information, please visit https://www.magnachip.com.

The Peregrine Semiconductor name, logo, and UltraCMOS are registered trademarks, and DuNE is a trademark, of Peregrine Semiconductor Corporation in the U.S.A., and other countries. All other trademarks mentioned herein are the property of their respective owners.

Peregrine Semiconductor Editorial Contact
Michelle Ragsdale, Sr. Public Relations Generalist
Phone: (858) 795-0154
mragsdale@psemi.com
http://www.psemi.com

Peregrine Semiconductor Investor Relations Contacts
Jay Biskupski, Chief Financial Officer
Phone: (858) 731-9400
ir@psemi.com

The Blueshirt Group
Suzanne Craig or Melanie Friedman
Phone: (415) 217-4962, (415) 217-4964
suzanne@blueshirtgroup.com
melanie@blueshirtgroup.com

MagnaChip Contacts
In the United States
Robert Pursel
Director of Investor Relations
Phone: 408-625-1262
robert.pursel@magnachip.com

In Korea
Chankeun Park
Senior Manager, Public Relations
Phone: +82-2-6903-3195
chankeun.park@magnachip.com
https://www.magnachip.com/

MagnaChip to Offer Enhanced 0.18um Embedded EEPROM Process Technology for use in Touch Sensing Applications

SEOUL, South Korea and CUPERTINO, Calif., Sept. 4, 2012 /PRNewswire/ — MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that it now offers a high voltage option for its 0.18um embedded EEPROM technology. This enhanced process increases noise immunity by improving upon signal-to-noise ratio (SNR), a critical issue in touch sensing IC performance.

The latest trend in Smartphone and Tablet PC touch applications has been a move towards thinner designs. These smaller form factors often make the electronic circuitry more susceptible to internal and external electrical noise. The various sources of noise, particularly in mobile devices, include the close proximity of the various semiconductor components within the system, battery chargers and even external factors such as temperature and humidity. Unwanted electrical noise can generate spurious signals creating false touches in the sensing circuitry. MagnaChip’s process technology enhances the functionality and performance of these IC designs by improving the signal-to-noise characteristics.

MagnaChip’s new 0.18um embedded EEPROM process was developed utilizing high-voltage capacitors and 20V transistors. This was done without compromising the existing 0.18um EEPROM and logic characteristics making the process highly suitable for touch sensing IC applications. Looking ahead, MagnaChip also intends to develop a 30V process which is suitable for larger screen mobile applications. Delivery is targeted for 2013.

Namkyu Park, Vice President of MagnaChip’s Foundry Marketing commented, “We are very pleased to offer a high voltage option for our enhanced 0.18um embedded EEPROM technology. Our goal is to continue to develop competitive features that meet the increasing application specific needs of our foundry customers.”

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

SOURCE MagnaChip Semiconductor Corporation

COLORADO SPRINGS, Colo. and SEOUL, South Korea, Aug. 14, 2012 /PRNewswire/ — Aeroflex Incorporated (“Aeroflex”), a wholly owned subsidiary of Aeroflex Holding Corp. (NYSE: ARX) and MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that Aeroflex’s Colorado Springs division has received QML-V qualification from the US Defense Logistics Agency (DLA), Land and Maritime for its Mixed-Signal products fabricated in MagnaChip’s 0.35um Triple-Well Mixed-Signal CMOS technology.

“QML-V qualification means that we have successfully demonstrated that our products fabricated at MagnaChip meet the specified performance, quality, and reliability levels of the US Department of Defense Product Qualification Program, especially for satellite and space applications,” said Paul Coe, Director of Quality at Aeroflex Colorado Springs.

“We have been utilizing the innovative mixed-signal technology offerings of MagnaChip for over 12 years in high reliability medical and industrial applications, and are pleased that we can now bring this technology to the space community in both QML-V Application Specific Integrated Circuits (ASICs) and standard microcircuit drawing (SMD) products,” said David Kerwin, Director of Mixed Signal products at Aeroflex Colorado Springs.

Aeroflex’s family of QML-V analog multiplexer products are currently fabricated at MagnaChip, as well as our recently announced family of voltage supervisors and customer-specific SMD products.

“We are pleased to be a partner to Aeroflex in the global space market and look forward to supporting their future engineering and manufacturing needs through a continued, successful partnership. MagnaChip is a leader in technology innovation and quality, and proud to be recognized as a QML-V supplier to Aeroflex,” said Namkyu Park, Vice President of MagnaChip’s Foundry Marketing.

“MagnaChip continues to expand its advanced analog and mixed-signal 0.35um and 0.18um CMOS process technology in such areas as non-volatile memories, high-voltage and low noise applications,” continued Namkyu Park. David Kerwin said, “You can expect to see Aeroflex continue to expand its QML-V offering leveraging MagnaChip’s technology investment in analog & mixed-signal processes.”

Aeroflex Colorado Springs, is a supplier of semicustom and standard VLSI circuits and custom circuit card assemblies. Aeroflex, Colorado Springs has received Qualified Manufacturer List (QML) certification for Class Q, Class T and Class V. Additionally, we have received a letter of compliance for ISO 9001 from the Defense Supply Center Columbus.

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

About Aeroflex

Aeroflex Holding Corp. is a leading global provider of high performance microelectronic components, and test and measurement equipment used by companies in the space, avionics, defense, commercial wireless communications, medical and other markets.

MAGNACHIP CONTACT:

In the United States:
Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:
Chankeun Park
Senior Manager, Public Relations
Tel. +82-2-6903-3195
chankeun.park@magnachip.com

AEROFLEX CONTACT:

Teresa Farris
MARCOM Manager
Aeroflex Microelectronic Solutions
Tel. 719-594-8035
teresa.farris@aeroflex.com

SOURCE MagnaChip Semiconductor Corporation

SEOUL, South Korea and CUPERTINO, Calif., June 19, 2012 – MagnaChip Semiconductor Corporation (“MagnaChip Semiconductor”) (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers a new premium 0.18-micron Bipolar-CMOS-DMOS (BCD) high voltage process. This new process features operability at 60V and will support additional voltage ranges (12V~60V) for applications that include DC-DC converters, Power-over-Ethernet, LED drivers, audio amps and PMICs for the mobile and consumer markets.

This new BCD process is fully compatible with standard CMOS processes and uses high density logic devices (1.8V) and performance analog devices (5V) with low flicker noise. MagnaChip is also developing 80V LDMOS devices featuring expanded operating ranges with completion expected by August, 2012.

Utilizing MagnaChip’s proprietary deep-trench isolation technology and high voltage LDMOS device optimization, this new premium 0.18um BCD process will enable high reliability and chip size reduction while improving isolation and low Rsp (specific on resistance) for foundry customers. To enhance design flexibility and cost competitiveness, this process will also support non-volatile memory (NVM), high K metal-insulator-metal capacitor, copper wire bonding, thick top metal, and redistribution layer process options.

“We are very pleased to offer our new 0.18um BCD high voltage process solution that enhances product performance over a wide range of voltages,” said Namkyu Park, Vice President of MagnaChip’s Foundry Marketing. “To meet the ever increasing technical requirements of foundry customers, our goal is to continue to enhance our process technology and expand our BCD portfolio.”

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, large portfolio of registered and pending patents and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.

CONTACTS:

In the United States:

Robert Pursel
Director of Investor Relations
Tel. 408-625-1262
robert.pursel@magnachip.com

In Korea:

Chankeun Park
Senior Manager, Public Relations
Tel.+82-2-6903-3195
chankeun.park@magnachip.com